隱蔽的污物影響鍍鎳層的結(jié)合強(qiáng)度
Concealed dirt affects the bonding strength of nickel plated layer.
工件孔眼、縫隙中的污物在前處理時(shí)若未能清理干凈，電鍍時(shí)會(huì)分解出來，這一范圍內(nèi)鍍層結(jié)合力是很差的，有時(shí)還可能當(dāng)即鼓泡、脫落。
If the dirt in the hole and gap of the workpiece can not be cleaned up before pretreatment, it will be decomposed when electroplating. The adhesion of the coating in this range is very poor, and sometimes it may be immediately bubbling and falling off.
氰化鍍銅層過薄影響鍍鎳層的結(jié)合強(qiáng)度
The influence of the thin copper plating layer on the bonding strength of nickel plating layer
有的銅鎳鉻工藝中先采取氰化鍍銅再酸性光亮鍍銅，如果氰化鍍銅層過薄，酸性鍍銅時(shí)容易出現(xiàn)“敷鍍”，在此鍍層上鍍鎳，鎳層應(yīng)力會(huì)把“敷鍍”層一起從氰化鍍銅表面拽下來。
In some copper-nickel-chromium plating processes, cyanide copper plating is adopted first and then acid bright copper plating is adopted. If cyanide copper plating is too thin, acidic copper plating is easy to occur "plating". Nickel plating on this coating, the nickel layer stress will pull the "plating" layer from the surface of cyanide copper plating together.
裸手接觸工件影響鍍鎳層的結(jié)合強(qiáng)度
Bare hand contact with workpiece affects the bonding strength of nickel plated layer.
鍍鎳過程中有時(shí)因工件掛得不夠正，如、凸出部位朝向了陽極要及時(shí)予以糾正，但在糾正時(shí)切勿用裸手扳，否則必然會(huì)留下指印并暴皮。
In the process of nickel plating, sometimes the workpiece is not hanging correctly enough, such as the tip, protruding parts toward the anode should be corrected in time, but do not use a bare hand wrench when correcting, otherwise it will inevitably leave a fingerprint and skin.
解決方法：可用潔凈的塑料或金屬棒撥正
Solution: use clean plastic or metal rods to correct.
有機(jī)雜質(zhì)污染影響鍍鎳層的結(jié)合強(qiáng)度
Influence of organic contamination on bonding strength of nickel plated layer
光亮鍍鎳溶液中有機(jī)雜質(zhì)產(chǎn)生的原因主要是：使用的化工原料純度低、光亮劑的分解和拋光膏的帶入以及工件的前處理欠徹底、隱蔽部位藏有污物的帶入。
The main causes of organic impurities in bright nickel plating solution are the low purity of chemical raw materials used, the decomposition of brighteners and the introduction of polishing paste, the incomplete pretreatment of workpieces and the entrance of dirt hidden in hidden parts.
解決方法：要定期進(jìn)行凈化處理
Solution: regular purification.
1、在攪拌下向溶液中加入雙氧水1~3ml/l；
1. Add hydrogen peroxide 1~3ml/l to the solution under stirring.
2、將溶液加熱到50~60℃
2. Heat the solution to 50~60 C.
3、在攪拌下加入粉末狀活性炭2~3 g/l (如果加的是顆粒狀的應(yīng)加倍加入）
3. Add the powdered activated carbon 2~3 g/l to the agitation (if the addition is granular, it should be doubled).
4、繼續(xù)攪拌2小時(shí)。
4, continue stirring for 2 hours.
5、靜置2小時(shí)后過濾。
5, filter for 2 hours after standing.
6、添加適量添加劑后試鍍。
6. Add proper amount of additives and test.